x900-q series
Pioneering the AI Future. Engineered for Precision Cooling and Sustainable Performance.
Powerful
- Support X86 Processors
- Support 32 DIMM slots, RDIMM up to 6400 MT/s
- Support High-performance OAM GPU Module Liquid-cooled support
Scalable
- Up to 8 × 800 G networking
- Compatible with full- and half-height NIC cards
Optimized
- Front I/O access for easy maintenance
- N+N redundant PSU for reliability
- High-efficiency thermal and DC/DC power solutions
Overview
The X960-Q series is an 8U AI server, featuring liquid-cooling architecture optimized for extreme AI and HPC workloads. It ensures high compute density with superior thermal efficiency.
Built for cloud datacenters and enterprise AI environments, it offers unmatched reliability, energy efficiency, and scalability for next-generation AI operations.
Application
AI cloud computing, LLM Training, Inference, HPC
Technical Specifications
| CPU | 2* X86 Processor up to 350W |
| GPU | 8* High-performance OAM GPU module liquid cooling |
| Memory | Up to 32* DDR5 DIMM Slot, support RDIMM up to 6400MT/s |
| Storage | 8* SFF NVMe slot (from switch) 2* SFF SATA/Nvme slot (from CPU, SATA need Add-in RAID card) Option: Internal: 2* 2280 M.2 slot(Add-in riser card) |
| PCIe Extension | Front PCIe Slot: 8* X16 FHHL/HHHL (from switch) Front PCIe Slot: 2* X16 FHHL (from CPU) |
| Enclosure Management | BMC: AST2600, 1* dedicated RJ45 MGMT port |
| IO | 2* USB3.0 Type-A Receptacle 1* PWR BTN with 1* PWR Indicator 1* Status LED 1* VGA 1* UART Port Over Type C 1* UID button& LED 1* GbE MGMT Port |
| Cooling | 13* 8086 FANs, N+1 Redundant |
| Operating Temp. | 5oC – 35oC |
| PSU | 2* 185mm Redundant 2700W HVDC/AC Input, 12V Output PSUs 8* 185mm Redundant 3200W HVDC/AC Input, 54V Output PSUs |
| Dimension | 352mm (H) x 448mm (W) x 900mm (D) |
Let’s Build What’s Next
Get in touch with our team to learn more about product specifications,
availability, and customized solutions.
